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Low cost anodic bonding for MEMS packaging applications

✍ Scribed by Robin Joyce, Kulwant Singh, Himani Sharma, Soney Varghese…

Book ID
120914967
Publisher
Springer-Verlag
Year
2013
Tongue
English
Weight
506 KB
Volume
20
Category
Article
ISSN
0946-7076

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✍ S. Ishizuka; N. Akiyama; T. Ogashiwa; T. Nishimori; H. Ishida; S. Shoji; J. Mizu 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 749 KB

In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 lm were formed on wafers by means of screen-printing. The bonding process was carried out at 300 °C under reduced pressure,