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Localized CO2 laser bonding process for MEMS packaging

✍ Scribed by Li SUN; A.P. MALSHE; S. CUNNINGHAM; A. MORRIS

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

MEMS post-packaging by localized heating

✍ Lin, L. 📂 Article 📅 2000 🏛 IEEE 🌐 English ⚖ 348 KB

Localized Laser Transmission Bonding for

✍ S. Theppakuttai; D.B. Shao; S.C. Chen 📂 Article 📅 2004 🏛 Society of Manufacturing Engineers 🌐 English ⚖ 136 KB

Low cost anodic bonding for MEMS packagi

✍ Robin Joyce, Kulwant Singh, Himani Sharma, Soney Varghese… 📂 Article 📅 2013 🏛 Springer-Verlag 🌐 English ⚖ 506 KB

Low temperature epoxy bonding for wafer

✍ Yong-Kook Kim; Eun-Kyung Kim; Soo-Won Kim; Byeong-Kwon Ju 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 805 KB

CO2 Lasers for Flexible Food Packaging :

✍ William R. Dinauer; Frank Gaebler 📂 Article 📅 2008 🏛 Wiley (John Wiley & Sons) ⚖ 137 KB

Pressureless bonding process using Ag na

✍ Jianfeng Yan; Guisheng Zou; Ai-ping Wu; Jialie Ren; Jiuchun Yan; Anming Hu; Y. Z 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 511 KB