Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

✍ Scribed by Jianfeng Yan; Guisheng Zou; Ai-ping Wu; Jialie Ren; Jiuchun Yan; Anming Hu; Y. Zhou

• Book ID: 113899390
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 511 KB
• Volume: 66
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2012.01.007