A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles

✍ Scribed by Y. Morisada; T. Nagaoka; M. Fukusumi; Y. Kashiwagi; M. Yamamoto; M. Nakamoto; H. Kakiuchi; Y. Yoshida

• Book ID: 107457369
• Publisher: Springer US
• Year: 2011
• Tongue: English
• Weight: 944 KB
• Volume: 40
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-011-1750-6