Laser Ultrasonic Inspection of Solder Bumps in Flip-Chip Packages Using Virtual Chip Package as Reference

✍ Scribed by Ume, C.; Jie Gong; Ahmad, R.; Valdes, A.

• Book ID: 119815841
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2011
• Tongue: English
• Weight: 754 KB
• Volume: 1
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2011.2160261