✦ LIBER ✦
Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages
✍ Scribed by Yu Gu; Toshio Nakamura
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 761 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0026-2714
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