Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

✍ Scribed by Ja-Myeong Koo; Yu-Na Kim; Jeong-Won Yoon; Dae-Gon Kim; Bo-In Noh; Jong-Woong Kim; Jung-Hoon Moon; Seung-Boo Jung

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 660 KB
• Volume: 483-484
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2006.11.164