Characterization of Intermetallic Compound Formation on In/Bi/Sn Solder Bumps Used in Pb-Alloy Josephson Chip Packaging

✍ Scribed by Fujiwara, K.; Asahi, M.

• Book ID: 117911656
• Publisher: IEEE
• Year: 1987
• Tongue: English
• Weight: 565 KB
• Volume: 10
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/tchmt.1987.1134729