✦ LIBER ✦

Kinetic study of the intermetallic compound formation between eutectic Sn–3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints

✍ Scribed by Chen, Hsiao Yun (author);Chen, Chih (author)

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Kinetic study of the intermetallic compo

✍ Chen, Hsiao Yun (author);Chen, Chih (author) 📂 Article 📅 2012 🏛 Cambridge University Press 🌐 English ⚖ 894 KB

Metallurgical reaction of the Sn-3.5Ag s

✍ Chien-Sheng Huang; Jenq-Gong Duh; Yen-Ming Chen 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 152 KB

Morphology and kinetic study of the inte

✍ Zhong Chen; Min He; Guojun Qi 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 990 KB

Effect of Ni layer thickness and solderi

✍ Won Kyoung Choi; Hyuck Mo Lee 📂 Article 📅 1999 🏛 Springer US 🌐 English ⚖ 314 KB