✦ LIBER ✦

Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization

✍ Scribed by Zhong Chen; Min He; Guojun Qi

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

TEM study on the interfacial reaction be

✍ Min-Ho Park; Eun-Jung Kwon; Han-Byul Kang; Seung-Boo Jung; Cheol-Woong Yang 📂 Article 📅 2007 🏛 TechnoPress 🌐 English ⚖ 687 KB

Interfacial Reaction Between Eutectic Sn

✍ Hsiao-Yun Chen; Chih Chen 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 673 KB

Characterization of Interfacial Reaction

✍ Han-Byul Kang; Jee-Hwan Bae; Jae-Wook Lee; Min-Ho Park; Jeong-Won Yoon; Seung-Bo 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 373 KB

Effect of Interfacial Reaction on the Te

✍ Z. Chen; M. He; A. Kumar; G.J. Qi 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 753 KB

Influence of solid-state interfacial rea

✍ Aditya Kumar; Zhong Chen 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 687 KB

Morphology and growth kinetics of interm

✍ M. L. Huang; T. Loeher; D. Manessis; L. Boettcher; A. Ostmann; H. Reichl 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 492 KB