Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders

✍ Scribed by M. L. Huang; T. Loeher; D. Manessis; L. Boettcher; A. Ostmann; H. Reichl

• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 492 KB
• Volume: 35
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-006-0202-1