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Internal thermal resistance of a multi-chip packaging design for VLSI based systems

✍ Scribed by Lee, Y.C.; Ghaffari, H.T.; Segelken, J.M.

Book ID: 117872608
Publisher: IEEE
Year: 1989
Tongue: English
Weight: 730 KB
Volume: 12
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.31420

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