✦ LIBER ✦
Internal thermal resistance of a multi-chip packaging design for VLSI-based systems : Y. C. Lee, H. T. Ghaffari and John M. Segelken. IEEE Trans. Compon. Hybrids. mfg Technol.12(2), 163 (1989)
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 136 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
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