✦ LIBER ✦
A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending
✍ Scribed by Leon Xu; Tommi Reinikainen; Wei Ren; Bo Ping Wang; Zhenxue Han; Dereje Agonafer
- Book ID
- 108210476
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 299 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0026-2714
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