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Influence of Bias-Induced Copper Diffusion on the Resistive Switching Characteristics of a SiON Thin Film

✍ Scribed by Yang, Po-Chun; Chang, Ting-Chang; Chen, Shih-Ching; Lin, Yu-Shih; Huang, Hui-Chun; Gan, Der-Shin

No coin nor oath required. For personal study only.

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