✦ LIBER ✦

In-situ observation of material migration in flip-chip solder joints under current stressing

✍ Scribed by C. M. Tsai; Yi-Shao Lai; Y. L. Lin; C. W. Chang; C. R. Kao

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Experimental Evidence for Formation of N

✍ M. Y. Tsai; Y. L. Lin; M. H. Tsai; Y. J. Chen; C. R. Kao 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 583 KB

Transmission Electron Microscopy Charact

✍ M. Y. Tsai; Y. L. Lin; Y. W. Lin; J. H. Ke; C. R. Kao 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 733 KB

Cross-interaction of under-bump metallur

✍ C. M. Tsai; W. C. Luo; C. W. Chang; Y. C. Shieh; C. R. Kao 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 643 KB

Evaluation of solder joint reliability i

✍ Dae-Gon Kim; Jong-Woong Kim; Seung-Boo Jung 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 696 KB

Effect of bump size on current density a

✍ Wei-Chih Kuan; S.W. Liang; Chih Chen 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 683 KB