Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing

✍ Scribed by M. Y. Tsai; Y. L. Lin; M. H. Tsai; Y. J. Chen; C. R. Kao

• Book ID: 107457360
• Publisher: Springer US
• Year: 2011
• Tongue: English
• Weight: 583 KB
• Volume: 40
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-011-1719-5