✦ LIBER ✦
Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints
✍ Scribed by M. Y. Tsai; Y. L. Lin; Y. W. Lin; J. H. Ke; C. R. Kao
- Book ID
- 107457047
- Publisher
- Springer US
- Year
- 2010
- Tongue
- English
- Weight
- 733 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0361-5235
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