Effect of bump size on current density and temperature distributions in flip-chip solder joints

✍ Scribed by Wei-Chih Kuan; S.W. Liang; Chih Chen

• Book ID: 108210806
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 683 KB
• Volume: 49
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2009.03.001