Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

✍ Scribed by Young-Doo Jeon; Kyung-Wook Paik; Kyung-Soon Bok; Woo-Suk Choi; Chul-Lae Cho

• Publisher: Springer US
• Year: 2002
• Tongue: English
• Weight: 642 KB
• Volume: 31
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-002-0109-4