Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method

✍ Scribed by Sang-Su Ha; Dae-Gon Kim; Jong-Woong Kim; Jeong-Won Yoon; Jin-Ho Joo; Young-Eui Shin; Seung-Boo Jung

• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 961 KB
• Volume: 84
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2007.05.062