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Improved Ni based composite Ohmic contact to n-SiC for high temperature and high power device applications

✍ Scribed by Cole, M. W.; Joshi, P. C.; Hubbard, C. W.; Wood, M. C.; Ervin, M. H.; Geil, B.; Ren, F.

Book ID
111909217
Publisher
American Institute of Physics
Year
2000
Tongue
English
Weight
780 KB
Volume
88
Category
Article
ISSN
0021-8979

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