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[IEEE Proceedings 1998 IEEE Hong Kong Electron Devices Meeting - Hong Kong (1998.08.29-1998.08.29)] Proceedings 1998 Hong Kong Electron Devices Meeting (Cat. No.98TH8368) - Wafer-level electromigration reliability test for deep-submicron interconnect metallization

✍ Scribed by Loh, Wye; Tse, Man; Chan, Lap; Eo, Keng

Book ID: 126751370
Publisher: IEEE
Year: 1998
Weight: 364 KB
Category: Article
ISBN-13: 9780780349322
DOI: 10.1109/HKEDM.1998.740210

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