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[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Effect of primary creep behavior on fatigue damage accumulation rates in accelerated thermal cycling of Sn3.0Ag0.5Cu Pb-free interconnects

✍ Scribed by Cuddalorepatta, Gayatri; Dasgupta, Abhijit

Book ID: 126675918
Publisher: IEEE
Year: 2008
Weight: 634 KB
Category: Article
ISBN: 1424421284
DOI: 10.1109/ESIME.2008.4525095

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