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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Quantitative characterization and process optimization of low-temperature bonded copper interconnects for 3-D integrated circuits

✍ Scribed by Tadepalli, R.; Thompson, C.V.

Book ID: 126759284
Publisher: IEEE
Year: 2003
Weight: 251 KB
Category: Article
ISBN-13: 9780780377974
DOI: 10.1109/IITC.2003.1219705

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