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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Stress relaxation in dual-damascene Cu interconnects to suppress stress-induced voiding

✍ Scribed by Kawano, M.; Fukase, T.; Yamamoto, Y.; Ito, T.; Yokogawa, S.; Tsuda, H.; Kunimune, Y.; Saitoh, T.; Ueno, K.; Sekine, M.

Book ID: 126745081
Publisher: IEEE
Year: 2003
Weight: 209 KB
Category: Article
ISBN-13: 9780780377974
DOI: 10.1109/IITC.2003.1219756

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