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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Highly reliable Cu/low-k dual-damascene interconnect technology with hybrid (PAE/SiOC) dielectrics for 65 nm-node high performance eDRAM

✍ Scribed by Kajita, A.; Usui, T.; Yamada, M.; Ogawa, E.; Katata, T.; Sakata, A.; Miyajima, H.; Kojima, A.; Kanamura, R.; Ohoka, Y.; Kawashima, H.; Tabuchi, K.; Nagahata, K.; Kato, Y.; Hayashi, T.; Kadomura, S.; Shibata, H.

Book ID: 126687710
Publisher: IEEE
Year: 2003
Weight: 188 KB
Category: Article
ISBN-13: 9780780377974
DOI: 10.1109/IITC.2003.1219697

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