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[IEEE IEEE International Electron Devices Meeting 2003 - Washington, DC, USA (8-10 Dec. 2003)] IEEE International Electron Devices Meeting 2003 - Novel self-assembled ultra-low-k porous silica films with high mechanical strength for 45 nm BEOL technology

✍ Scribed by Oku, Y.; Yamada, K.; Goto, T.; Seino, Y.; Ishikawa, A.; Ogatal, T.; Kohmura, K.; Fujii, N.; Hata, N.; Ichikawa, R.; Yoshino, T.; Negoro, C.; Nakano, A.; Sonoda, Y.; Takada, S.; Miyoshi, H.; Oike, S.; Tanaka, H.; Matsuo, H.; Kinoshita, K.; Kikkawa, T.

Book ID: 126638335
Publisher: IEEE
Year: 2003
Weight: 278 KB
Edition: 1
Category: Article
ISBN-13: 9780780378728
DOI: 10.1109/IEDM.2003.1269184

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