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[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Area array interconnection with Cu-PI thin films on a multi-layer glass-ceramic substrate

✍ Scribed by Howell, W.J.; Ference, T.G.; Rao, V.; Scheid, D.; Budnaitis, J.; Streif, R.

Book ID: 124097540
Publisher: IEEE
Year: 1993
Weight: 436 KB
Category: Article
ISBN-13: 9780780307940
DOI: 10.1109/ECTC.1993.346709

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