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[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Flip-chip on FR-4 integrated circuit packaging

✍ Scribed by Powell, D.O.; Trivedi, A.K.

Book ID: 118120065
Publisher: IEEE
Year: 1993
Weight: 611 KB
Volume: 0
Category: Article
ISBN-13: 9780780307940
DOI: 10.1109/ectc.1993.346722

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