𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Stress related offset voltage shift in a precision operational amplifier

✍ Scribed by Gee, S.; Doan, T.; Gilbert, K.

Book ID: 121680674
Publisher: IEEE
Year: 1993
Weight: 806 KB
Category: Article
ISBN-13: 9780780307940
DOI: 10.1109/ectc.1993.346764

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE IEEE 43rd Electronic Components an

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Flip-chip on FR-4 integrated circuit packaging

✍ Powell, D.O.; Trivedi, A.K. 📂 Article 📅 1993 🏛 IEEE ⚖ 611 KB

[IEEE IEEE 43rd Electronic Components an

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Green Tape via design-FEM and proposed design philosophy

✍ Poulin, T.R.; Nguyen, L.T. 📂 Article 📅 1993 🏛 IEEE ⚖ 630 KB

[IEEE IEEE 43rd Electronic Components an

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Thermosonic bonding: an alternative to area-array solder connections

✍ Sa-Yoon Kang, ; Teh-Hua Ju, ; Lee, Y.C. 📂 Article 📅 1993 🏛 IEEE ⚖ 568 KB

[IEEE IEEE 43rd Electronic Components an

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - The thermal degradation and decomposition of brominated epoxy FR-4 laminates

✍ Yuan, J.; Packowski, M.A. 📂 Article 📅 1993 🏛 IEEE ⚖ 525 KB

[IEEE IEEE 43rd Electronic Components an

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Current carrying capacity of copper conductors in printed wiring boards

✍ Pan, T.-Y.; Poulson, R.H.; Blair, H.D. 📂 Article 📅 1993 🏛 IEEE ⚖ 400 KB

[IEEE IEEE 43rd Electronic Components an

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Efficient optical fiber-to-waveguide coupling suitable for passive alignment

✍ Barry, T.S.; Cordaro, M.H.; Krchnavek, R.R.; Nakagawa, K.; Phelps, C.W.; Rode, D 📂 Article 📅 1993 🏛 IEEE ⚖ 371 KB