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[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Thermosonic bonding: an alternative to area-array solder connections

✍ Scribed by Sa-Yoon Kang, ; Teh-Hua Ju, ; Lee, Y.C.

Book ID: 121283648
Publisher: IEEE
Year: 1993
Weight: 568 KB
Category: Article
ISBN-13: 9780780307940
DOI: 10.1109/ECTC.1993.346749

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