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[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Manufacture of advanced Cu-PI multi chip modules

✍ Scribed by Rao, V.; Hutchins, D.; Reagan, J.; Scheid, D.; Streif, R.; Syrstad, T.; Eggerding, C.; Redmond, T.

Book ID: 124097541
Publisher: IEEE
Year: 1993
Weight: 779 KB
Category: Article
ISBN-13: 9780780307940
DOI: 10.1109/ECTC.1993.346742

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