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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Monte-Carlo simulation of electromigration failure distributions of submicron contacts and vias: a new extrapolation methodology for reliability estimate

✍ Scribed by Huang, J.S.; Oates, A.S.

Book ID: 126689118
Publisher: IEEE
Year: 2000
Weight: 239 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854327

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