𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - A three-dimensional stochastic wire-length distribution for variable separation of strata

✍ Scribed by Joyner, J.W.; Zarkesh-Ha, P.; Davis, J.A.; Meindl, J.D.

Book ID: 120579289
Publisher: IEEE
Year: 2000
Weight: 364 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854301

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE IEEE 2000 International Interconne

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - The effects of substrate resistivity on RF component and circuit performance

✍ Floyd, B.A.; Chih-Ming Hung, ; O, K.K. 📂 Article 📅 2000 🏛 IEEE ⚖ 305 KB

[IEEE IEEE 2000 International Interconne

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Single mask metal-insulator-metal (MIM) capacitor with copper damascene metallization for sub-0.18 μm mixed mode signal and system-on-a-chip (SoC) applications

✍ Ruichen Liu, ; Cheng-Yih Lin, ; Harris, E.; Merchant, S.; Downey, S.W.; Weber, G 📂 Article 📅 2000 🏛 IEEE ⚖ 346 KB

[IEEE IEEE 2002 International Interconne

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Scaling trends for the on chip power dissipation

✍ Chandra, G.; Kapur, P.; Saraswat, K.C. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 206 KB

[IEEE IEEE 2002 International Interconne

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Comparisons between electrical and optical interconnects for on-chip signaling

✍ Kapur, P.; Saraswat, K.C. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 237 KB

[IEEE Proceedings of the IEEE 2004 Inter

[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - On wafer de-embedding for SiGe/BiCMOS/RFCMOS transmission line interconnect characterization

✍ Tretiakov, Y.; Vaed, K.; Ahlgren, D.; Rascoe, J.; Venkatadri, S.; Woods, W. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 213 KB

[IEEE IEEE International Interconnect Te

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Low damage ashing using H/sub 2//He plasma for porous ultra low-k

✍ Matsushita, A.; Ohashi, N.; Inukai, K.; Shin, H.J.; Sone, S.; Sudou, K.; Misawa, 📂 Article 📅 2003 🏛 IEEE ⚖ 194 KB