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[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - An integrated characterization and modeling methodology for CMP dielectric planarization

✍ Scribed by Ouma, D.; Boning, D.; Chung, J.; Shin, G.; Olsen, L.; Clark, J.

Book ID: 126748989
Publisher: IEEE
Year: 1998
Weight: 407 KB
Category: Article
ISBN-13: 9780780342859
DOI: 10.1109/IITC.1998.704753

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