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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Advanced chip to wafer bonding: A flip chip to wafer bonding technology for high volume 3DIC production providing lowest cost of ownership

✍ Scribed by Sigl, A.; Pargfrieder, S.; Pichler, C.; Scheiring, C.; Kettner, P.

Book ID: 126761567
Publisher: IEEE
Year: 2009
Weight: 1015 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270559

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