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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - A thermal model for calculating thermal resistance of eccentric heat source on rectangular plate with convective cooling existing at upper and lower surfaces

✍ Scribed by Luo, Xiaobing; Mao, Zhangming; Liu, Sheng

Book ID: 126611818
Publisher: IEEE
Year: 2009
Weight: 977 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270746

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