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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - A study of the heat transfer characteristics of the micro-channel heat sink

✍ Scribed by Wang, Shun; Zhang, Yan; Fu, Yifeng; Liu, Johan; Wang, Xiaojing; Cheng, Zhaonian

Book ID: 126596797
Publisher: IEEE
Year: 2009
Weight: 843 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270754

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