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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Modal analysis for BGA shock test board and fixture design

✍ Scribed by Geng, P.; Beltman, W.M.; Chen, P.H.; Daskalakis, G.; Shia, D.; Williams, M.H.

Book ID: 126705212
Publisher: IEEE
Year: 2003
Weight: 270 KB
Category: Article
ISBN-13: 9780780382053
DOI: 10.1109/EPTC.2003.1271524

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