𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Post clean elimination at backgrind

✍ Scribed by Phaoharuhan, P.

Book ID: 126623320
Publisher: IEEE
Year: 2003
Weight: 271 KB
Category: Article
ISBN-13: 9780780382053
DOI: 10.1109/EPTC.2003.1271602

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Optical MEMS switch control and packaging

✍ Cai, H.; Wu, J.H.; J, L.; Zhang, X.M.; Wang, Y.X.; Lu, C.; Liu, A.Q. 📂 Article 📅 2003 🏛 IEEE ⚖ 192 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Flip chip assembly of MEMS inductors

✍ Pang, A.J.; Wang, C.H.; Sangster, A.J. 📂 Article 📅 2003 🏛 IEEE ⚖ 213 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Three dimensional stacked modules using silicon carrier

✍ Kripesh, V.; Ganesh, V.P.; Seung Wook Yoon, ; Sharma, R.K.; Mohanraj, S.; Iyer, 📂 Article 📅 2003 🏛 IEEE ⚖ 418 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Mixed-mode S-parameter characterization of differential structures

✍ Fan, W.; Lu, A.; Wai, L.L.; Lok, B.K. 📂 Article 📅 2003 🏛 IEEE ⚖ 253 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Cooling of a stacked multichip module - tests and validations

✍ Chen, X.Y.; Toh, K.C.; Chai, J.C.; Wong, T.N.; Pinjala, D.; Navas, O.K.; Ganesh, 📂 Article 📅 2003 🏛 IEEE ⚖ 329 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Test strategies for fine pitch wafer level packaged devices

✍ Jayabalan, J.; Rotaru, M.D.; Deng Chun, ; Feng Han Hua, ; Iyer, M.K.; Ooi, B.L.; 📂 Article 📅 2003 🏛 IEEE ⚖ 242 KB