𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Flip chip assembly of MEMS inductors

✍ Scribed by Pang, A.J.; Wang, C.H.; Sangster, A.J.

Book ID: 120916079
Publisher: IEEE
Year: 2003
Weight: 213 KB
Category: Article
ISBN-13: 9780780382053
DOI: 10.1109/EPTC.2003.1271533

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Comparison of bonding defects for longitudinal and transverse thermosonic flip-chip

✍ Leung, M.L.H.; Lai-Wah, H.C.; Chou-Kee, P.L. 📂 Article 📅 2003 🏛 IEEE ⚖ 377 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Investigation on the high frequency thermosonic flip chip bonding under low temperature

✍ Pang, C.C.-H.; Sham, M.-L.; Hung, K.-Y. 📂 Article 📅 2003 🏛 IEEE ⚖ 223 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Test strategies for fine pitch wafer level packaged devices

✍ Jayabalan, J.; Rotaru, M.D.; Deng Chun, ; Feng Han Hua, ; Iyer, M.K.; Ooi, B.L.; 📂 Article 📅 2003 🏛 IEEE ⚖ 242 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Resistance characterization of flip chip joint formed using Au bumps and anisotropic conductive adhesives

✍ Lee, C.; Yeo, A. 📂 Article 📅 2003 🏛 IEEE ⚖ 400 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Printed wiring board with coaxial wirings for high speed signal transmission

✍ Kikuchi, K.; Tanaka, N.; Nakagawa, H.; Tokoro, K.; Kawashima, A.; Kawamata, Y.; 📂 Article 📅 2003 🏛 IEEE ⚖ 268 KB

[IEEE 5th Electronics Packaging Technolo

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Control of adhesive dispensing parameters during transition from research to production environments

✍ Burga, R.; Tausek, A. 📂 Article 📅 2003 🏛 IEEE ⚖ 274 KB