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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Investigation on the high frequency thermosonic flip chip bonding under low temperature

✍ Scribed by Pang, C.C.-H.; Sham, M.-L.; Hung, K.-Y.

Book ID: 121313439
Publisher: IEEE
Year: 2003
Weight: 223 KB
Category: Article
ISBN-13: 9780780382053
DOI: 10.1109/EPTC.2003.1271549

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