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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Resistance characterization of flip chip joint formed using Au bumps and anisotropic conductive adhesives

✍ Scribed by Lee, C.; Yeo, A.

Book ID: 120570345
Publisher: IEEE
Year: 2003
Weight: 400 KB
Category: Article
ISBN-13: 9780780382053
DOI: 10.1109/EPTC.2003.1271548

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