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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Test strategies for fine pitch wafer level packaged devices

✍ Scribed by Jayabalan, J.; Rotaru, M.D.; Deng Chun, ; Feng Han Hua, ; Iyer, M.K.; Ooi, B.L.; Leong, M.S.; Ang, S.; Tay, A.A.O.; Keezer, D.; Rao, T.

Book ID: 120203091
Publisher: IEEE
Year: 2003
Weight: 242 KB
Category: Article
ISBN-13: 9780780382053
DOI: 10.1109/EPTC.2003.1271553

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