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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Three dimensional stacked modules using silicon carrier

✍ Scribed by Kripesh, V.; Ganesh, V.P.; Seung Wook Yoon, ; Sharma, R.K.; Mohanraj, S.; Iyer, M.

Book ID: 126649370
Publisher: IEEE
Year: 2003
Weight: 418 KB
Category: Article
ISBN-13: 9780780382053
DOI: 10.1109/EPTC.2003.1271484

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