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[IEEE 53rd Electronic Components and Technology Conference, 2003. Proceedings. - New Orleans, Louisiana, USA (2003.05.30-2003.05.30)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

✍ Scribed by Schubert, A.; Dudek, R.; Auerswald, E.; Gollbardt, A.; Michel, B.; Reichl, H.

Book ID: 126678206
Publisher: IEEE
Year: 2003
Weight: 554 KB
Category: Article
ISBN-13: 9780780377912
DOI: 10.1109/ECTC.2003.1216343

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