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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packages

✍ Scribed by Perkins, A.; Sitaraman, S.K.

Book ID: 126743168
Publisher: IEEE
Year: 2003
Weight: 713 KB
Category: Article
ISBN-13: 9780780377912
DOI: 10.1109/ECTC.2003.1216312

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