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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Fluxless flip chip technique with Sn-rich Au/Sn solder bumps

✍ Scribed by Dongwook Kim, ; Chin C. Lee, ; Sokolowski, W.M.

Book ID: 126655179
Publisher: IEEE
Year: 2003
Weight: 401 KB
Category: Article
ISBN-13: 9780780377912
DOI: 10.1109/ECTC.2003.1216387

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