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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy

✍ Scribed by Pang, J.H.L.; Xiong, B.S.; Neo, C.C.; Mang, X.R.; Low, T.H.

Book ID: 126837494
Publisher: IEEE
Year: 2003
Weight: 598 KB
Category: Article
ISBN-13: 9780780377912
DOI: 10.1109/ectc.2003.1216355

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